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| M Features TC1054/TC1055/TC1186 Package Type 5-Pin SOT-23A VOUT 5 TC1054 TC1055 TC1186 1 VIN 2 GND 3 SHDN ERROR 4 50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown and ERROR Output * Low Ground Current for Longer Battery Life * Low Dropout Voltage * Choice of 50 mA (TC1054), 100 mA (TC1055) and 150 mA (TC1186) Output * High Output Voltage Accuracy * Standard or Custom Output Voltages * Power-Saving Shutdown Mode * ERROR Output Can Be Used as a Low Battery Detector or Microcontroller Reset Generator * Over-Current and Over-Temperature Protection * 5-Pin SOT-23A Package * Pin Compatible Upgrades for Bipolar Regulators NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A) Applications * * * * * * * Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers General Description The TC1054, TC1055 and TC1186 are high accuracy (typically 0.5%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for battery-operated systems, the devices' CMOS construction minimizes ground current, extending battery life. Total supply current is typically 50 A at full load (20 to 60 times lower than in bipolar regulators). The devices' key features include low noise operation, low dropout voltage - typically 85 mV (TC1054), 180 mV (TC1055) and 270 mV (TC1186) at full load -- and fast response to step changes in load. An error output (ERROR) is asserted when the devices are out-ofregulation (due to a low input voltage or excessive output current). ERROR can be used as a low battery warning or as a processor RESET signal (with the addition of an external RC network). Supply current is reduced to 0.5 A (max), with both VOUT and ERROR disabled when the shutdown input is low. The devices incorporate both over-temperature and over-current protection. The TC1054, TC1055 and TC1186 are stable with an output capacitor of only 1 F and have a maximum output current of 50 mA, 100 mA and 150 mA, respectively. For higher output current regulators, please refer to the TC1173 (IOUT = 300 mA) data sheet (DS21632). Typical Application 1 5 + 1 F VIN VIN VOUT VOUT 2 GND TC1054 TC1055 TC1186 1 M 3 SHDN ERROR 4 ERROR Shutdown Control (from Power Control Logic) 2003 Microchip Technology Inc. DS21350C-page 1 TC1054/TC1055/TC1186 1.0 ELECTRICAL CHARACTERISTICS Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Input Voltage ....................................................................6.5V Output Voltage ..................................... (-0.3V) to (VIN + 0.3V) Power Dissipation ......................... Internally Limited (Note 6) Maximum Voltage on Any Pin ...................VIN +0.3V to -0.3V Operating Junction Temperature Range .. -40C < TJ < 125C Storage Temperature ....................................-65C to +150C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH , TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Parameters Input Operating Voltage Maximum Output Current Sym V IN IOUTMAX Min 2.7 50 100 150 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- 20 40 0.05 0.5 0.5 2 65 85 180 270 50 0.05 64 300 0.04 160 10 Max 6.0 -- -- -- -- -- 0.35 2 3 -- -- 120 250 400 80 0.5 -- 450 -- -- -- Units V mA Note 8 TC1054 TC1055 TC1186 Note 1 Conditions Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation: TC1054; TC1055 TC1186 Dropout Voltage: VOUT TCVOUT VOUT/VIN VOUT/VOUT VR - 2.5% VR 0.5% VR + 2.5% V ppm/C Note 2 % % mV (VR + 1V) VIN 6V (Note 3) IL = 0.1 mA to IOUTMAX IL = 0.1 mA to IOUTMAX IL = 100 A IL = 20 mA IL = 50 mA IL = 100 mA IL = 150 mA (Note 4) SHDN = VIH, IL = 0 A (Note 9) SHDN = 0V f 1 kHz VOUT = 0V Notes 5, 6 VIN-V OUT TC1055; TC1186 TC1186 Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Thermal Shutdown Die Temperature Thermal Shutdown Hysteresis IIN IINSD PSRR IOUTSC VOUT /PD TSD TSD A A dB mA V/W C C Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. 2: TC VOUT = (VOUTMAX - VOUTMIN )x 106 VOUT x T 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0, "Thermal Considerations", for more details. 7: Hysteresis voltage is referenced by V R. 8: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 9: Apply for junction temperatures of -40C to +85C. DS21350C-page 2 2003 Microchip Technology Inc. TC1054/TC1055/TC1186 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH , TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Parameters Output Noise SHDN Input SHDN Input High Threshold SHDN Input Low Threshold ERROR Output Minimum VIN Operating Voltage Output Logic Low Voltage ERROR Threshold Voltage ERROR Positive Hysteresis VINMIN VOL VTH V HYS 1.0 -- -- -- -- -- 0.95 x VR 50 -- 400 -- -- V mV V mV 1 mA Flows to ERROR See Figure 4-2 Note 7 V IH VIL 45 -- -- -- -- 15 %VIN %VIN VIN = 2.5V to 6.5V VIN = 2.5V to 6.5V Sym eN Min -- Typ 260 Max -- Units Conditions nV/Hz IL = IOUTMAX Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. 2: TC VOUT = (VOUTMAX - VOUTMIN )x 106 VOUT x T 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0, "Thermal Considerations", for more details. 7: Hysteresis voltage is referenced by V R. 8: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 9: Apply for junction temperatures of -40C to +85C. 2003 Microchip Technology Inc. DS21350C-page 3 TC1054/TC1055/TC1186 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. 0.020 0.018 0.100 ILOAD = 10 mA DROPOUT VOLTAGE (V) 0.090 0.080 0.070 0.060 0.050 0.040 0.030 0.020 0.010 0.000 0 20 50 TEMPERATURE (C) 70 125 ILOAD = 50 mA DROPOUT VOLTAGE (V) 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40 -20 CIN = 1 F COUT = 1 F CIN = 1 F COUT = 1 F -40 -20 0 20 50 TEMPERATURE (C) 70 125 FIGURE 2-1: Dropout Voltage vs. Temperature (ILOAD = 10 mA). 0.200 0.180 DROPOUT VOLTAGE (V) FIGURE 2-4: Dropout Voltage vs. Temperature (ILOAD = 50 mA). 0.300 ILOAD = 100 mA ILOAD = 150 mA DROPOUT VOLTAGE (V) 0.250 0.200 0.150 0.100 0.050 0.000 0.160 0.140 0.120 0.100 0.080 0.060 0.040 0.020 0.000 -40 -20 0 20 50 70 125 CIN = 1 F COUT = 1 F CIN = 1 F COUT = 1 F -40 -20 0 20 50 TEMPERATURE (C) 70 125 TEMPERATURE (C) FIGURE 2-2: Dropout Voltage vs. Temperature (ILOAD = 100 mA). 90 80 FIGURE 2-5: Dropout Voltage vs. Temperature (ILOAD = 150 mA). 90 ILOAD = 10 mA GND CURRENT (A) 80 70 60 50 40 30 20 10 0 ILOAD = 100 mA GND CURRENT (A) 70 60 50 40 30 20 10 0 CIN = 1 F COUT = 1 F 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) CIN = 1 F COUT = 1 F 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) FIGURE 2-3: (ILOAD = 10 mA). Ground Current vs. VIN FIGURE 2-6: (ILOAD = 100 mA). Ground Current vs. VIN DS21350C-page 4 2003 Microchip Technology Inc. TC1054/TC1055/TC1186 Note: Unless otherwise indicated, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. 80 70 GND CURRENT (A) 3.5 ILOAD = 150 mA ILOAD = 0 3 2.5 60 VOUT (V) 50 40 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 2 1.5 1 CIN = 1 F COUT = 1 F 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 CIN = 1 F COUT = 1 F 5.5 6 6.5 7 VIN (V) FIGURE 2-7: (ILOAD = 150 mA). 3.5 3.0 2.5 VOUT (V) Ground Current vs. VIN FIGURE 2-10: (ILOAD = 0 mA). VOUT vs. VIN ILOAD = 100 mA 3.320 3.315 3.310 3.305 ILOAD = 10 mA 2.0 VOUT (V) 1.5 1.0 0.5 0.0 0 3.300 3.295 3.290 CIN = 1 F COUT = 1 F 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V) 3.285 3.280 3.275 -40 CIN = 1 F COUT = 1 F VIN = 4.3V -20 -10 0 20 40 85 125 FIGURE 2-8: (ILOAD = 100 mA). 3.290 3.288 3.286 VOUT vs. VIN TEMPERATURE (C) FIGURE 2-11: Output Voltage (3.3V) vs. Temperature (ILOAD = 10 mA). 5.025 5.020 5.015 ILOAD = 150 mA ILOAD = 10 mA VOUT (V) 3.284 VOUT (V) CIN = 1 F COUT = 1 F VIN = 4.3V -40 -20 -10 0 20 40 85 125 3.282 3.280 3.278 3.276 3.274 5.010 5.005 5.000 4.995 4.990 4.985 VIN = 6V CIN = 1 F COUT = 1 F -40 -20 -10 0 20 40 85 125 TEMPERATURE (C) TEMPERATURE (C) FIGURE 2-9: (ILOAD = 150 mA). VOUT vs. VIN FIGURE 2-12: Output Voltage (5V) vs. Temperature (ILOAD = 10 mA). 2003 Microchip Technology Inc. DS21350C-page 5 TC1054/TC1055/TC1186 Note: Unless otherwise indicated, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. 10.0 RLOAD = 50 COUT = 1 F CIN = 1 F 4.994 4.992 4.990 4.988 ILOAD = 150 mA NOISE (V/Hz) 1.0 VOUT (V) 4.986 4.984 4.982 4.980 4.978 4.976 4.974 -40 -20 -10 0 20 40 85 125 VIN = 6V CIN = 1 F COUT = 1 F 0.1 TEMPERATURE (C) 0.0 0.01K 0.1K 1K 10K 100K 1000K FREQUENCY (Hz) FIGURE 2-13: Output Voltage (5V) vs. Temperature (ILOAD = 10 mA). 70 60 FIGURE 2-16: Output Noise vs. Frequency. 1000 COUT = 1 F to 10 F ILOAD = 10 mA 100 COUT ESR () 10 1 Stable Region GND CURRENT (A) 50 40 30 20 10 0 -40 -20 -10 0 20 40 TEMPERATURE (C) 85 125 VIN = 6V CIN = 1 F COUT = 1 F 0.1 0.01 0 10 20 30 40 50 60 70 80 90 100 LOAD CURRENT (mA) FIGURE 2-14: GND Current vs. Temperature (ILOAD = 10 mA). 80 70 GND CURRENT (A) FIGURE 2-17: Current. Stability Region vs. Load ILOAD = 150 mA VSHDN 60 50 40 30 20 10 0 -40 -20 -10 0 20 40 85 125 TEMPERATURE (C) VIN = 6V CIN = 1 F COUT = 1 F VOUT FIGURE 2-15: GND Current vs. Temperature (ILOAD = 150 mA). Conditions: C IN = 1 F, COUT = 1 F, ILOAD = 100 mA, VIN = 4.3V, Temp = +25C, Fall Time = 184 s FIGURE 2-18: LDO. Measure Rise Time of 3.3V DS21350C-page 6 2003 Microchip Technology Inc. TC1054/TC1055/TC1186 Note: Unless otherwise indicated, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. VSHDN VSHDN VOUT VOUT Conditions: C IN = 1 F, COUT = 1 F, ILOAD = 100 mA, VIN = 6V, Temp = +25C, Fall Time = 192 s Conditions: C IN = 1 F, COUT = 1 F, ILOAD = 100 mA, VIN = 4.3V, Temp = +25C, Fall Time = 52 s FIGURE 2-19: LDO. Measure Rise Time of 5.0V FIGURE 2-21: LDO. Measure Fall Time of 3.3V VSHDN VOUT VOUT Conditions: V IN = 6V, CIN = 0 F, COUT = 1 F ILOAD was increased until temperature of die reached about 160C, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160C. The regulator remains off until die temperature drops to approximately 150C. Conditions: C IN = 1 F, COUT = 1 F, ILOAD = 100 mA, VIN = 6V, Temp = +25C, Fall Time = 88 s FIGURE 2-22: LDO. Measure Fall Time of 5.0V FIGURE 2-20: Thermal Shutdown Response of 5.0V LDO. 2003 Microchip Technology Inc. DS21350C-page 7 TC1054/TC1055/TC1186 3.0 PIN DESCRIPTIONS 3.3 Shutdown Control Input (SHDN) The descriptions of the pins are listed in Table 3-1. The regulator is fully enabled when a logic-high is applied to SHDN. The regulator enters shutdown when a logic-low is applied to SHDN. During shutdown, output voltage falls to zero, ERROR is open-circuited and supply current is reduced to 0.5 A (max). TABLE 3-1: PIN FUNCTION TABLE Description Unregulated supply input Ground terminal Shutdown control input Pin No. Symbol 1 2 3 4 5 VIN GND SHDN 3.4 Out Of Regulation Flag (ERROR) ERROR Out-of-Regulation Flag (Open-drain output) VOUT Regulated voltage output ERROR goes low when V OUT is out-of-tolerance by approximately -5%. 3.5 Regulated Voltage Output (VOUT) 3.1 Unregulated Supply Input (VIN) Connect the output load to VOUT of the LDO. Also connect the positive side of the LDO output capacitor as close as possible to the VOUT pin. Connect unregulated input supply to the VIN pin. If there is a large distance between the input supply and the LDO regulator, some input capacitance is necessary for proper operation. A 1 F capacitor connected from VIN to ground is recommended for most applications. 3.2 Ground Terminal (GND) Connect the unregulated input supply ground return to GND. Also connect the negative side of the 1 F typical input decoupling capacitor close to GND and the negative side of the output capacitor C OUT to GND. DS21350C-page 8 2003 Microchip Technology Inc. TC1054/TC1055/TC1186 4.0 DETAILED DESCRIPTION 4.1 ERROR Open-Drain Output The TC1054, TC1055 and TC1186 are precision fixed output voltage regulators (If an adjustable version is desired, please see the TC1070/TC1071/TC1187 data sheet (DS21353)). Unlike bipolar regulators, the TC1054, TC1055 and TC1186 supply current does not increase with load current. Figure 4-1 shows a typical application circuit, where the regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 A (typical), VOUT falls to zero volts, and ERROR is opencircuited. ERROR is driven low whenever VOUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated VOUT, regardless of the programmed output voltage value (e.g. ERROR = VOL at 4.75V (typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active when VOUT falls to V TH and inactive when VOUT rises above VTH by V HYS. As shown in Figure 4-1, ERROR can be used either as a battery low flag or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 msec to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). + + 1 F VIN VOUT +1 F C1 VOUT VOUT VTH HYSTERESIS (VH) Battery TC1054 TC1055 TC1186 GND V+ SHDN ERROR Shutdown Control (to CMOS Logic or Tie to VIN if unused) R1 1MW 0.2 F C2 BATTLOW or RESET ERROR VIH VOL C2 Required Only if ERROR is used as a Processor RESET Signal (See Text) FIGURE 4-2: Error Output Operation. FIGURE 4-1: Typical Application Circuit. 4.2 Output Capacitor A 1 F (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0, with a resonant frequency above 1 MHz. A 1 F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 2003 Microchip Technology Inc. DS21350C-page 9 TC1054/TC1055/TC1186 5.0 5.1 THERMAL CONSIDERATIONS Thermal Shutdown Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX VOUTMIN ILOADMAX TJMAX TAMAX Find: = 3.0V +5% = 2.7V - 2.5% = 40 mA = +125C = +55C 1. 2. Actual power dissipation Maximum allowable dissipation Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C. 5.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input voltage, output voltage and output current. The following equation is used to calculate worst case actual power dissipation: EQUATION 5-1: P D ( V INMAX - V OUTMIN )ILOA DMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current Actual power dissipation: P D ( V INMAX - V OUTMIN )I LO ADMA X = [ ( 3.0 x 1.05 ) - ( 2.7 x 0.975 ) ]40 x 10 = 20.7mW Maximum allowable power dissipation: ( T JMAX - T AMAX ) P DMAX = ------------------------------------------ JA ( 125 - 55 ) = ------------------------220 = 318mW In this example, the TC1054 dissipates a maximum of 20.7 mW; below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. -3 The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). The 5-Pin SOT-23A package has a JA of approximately 220C/Watt. EQUATION 5-2: ( T JMAX - T AMAX ) P DMAX = ------------------------------------------ JA Where all terms are previously defined. 5.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads and wide power supply bus lines combine to lower JA and, therefore, increase the maximum allowable power dissipation limit. DS21350C-page 10 2003 Microchip Technology Inc. TC1054/TC1055/TC1186 6.0 6.1 PACKAGING INFORMATION Package Marking Information 5-Pin SOT-23A 5 4 12 3 4 1 2 3 1 & 2 represents part number code + temperature range and voltage TC1054 Code CY C1 C2 CZ C8 C3 C4 C9 C0 C6 TC1055 Code DY D1 D2 DZ D8 D3 D4 D9 D0 D6 TC1186 Code PY P1 P2 PZ P8 P3 P5 P9 P0 P7 (V) 1.8 2.5 2.7 2.8 2.85 3.0 3.3 3.6 4.0 5.0 3 4 represents year and quarter code represents lot ID number 2003 Microchip Technology Inc. DS21350C-page 11 TC1054/TC1055/TC1186 5-Lead Plastic Small Outline Transistor (OT) (SOT23) E E1 p B p1 D n 1 c A A2 L A1 Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B MIN INCHES* NOM 5 .038 .075 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 MAX MIN .035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0 .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 MILLIMETERS NOM 5 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5 MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091 DS21350C-page 12 2003 Microchip Technology Inc. TC1054/TC1055/TC1186 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples: a) b) c) Device: TC1054: TC1055: TC1186: V = 50 mA LDO with Shutdown & /Error output 100 mA LDO with Shutdown & /Error output 150 mA LDO with Shutdown & /Error output -40C to +125C TC1054-1.8VCT713: 50 mA LDO, 1.8V TC1054-2.8VCT713: 50 mA LDO, 2.8V TC1054-3.3VCT713: 50 mA LDO, 3.3V TC1054-5.0VCT713: 50 mA LDO, 5.0V TC1055-2.5VCT713: 100 mA LDO, 2.5V TC1055-2.85VCT713: 100 mA LDO, 2.85V TC1055-3.6VCT713: 100 mA LDO, 3.6V TC1055-5.0VCT713: 100 mA LDO, 5.0V TC1186-2.7VCT713: 150 mA LDO, 2.7V TC1186-2.85VCT713: 150 mA LDO, 2.85V TC1186-4.0VCT713: 150 mA LDO, 4.0V TC1186-5.0VCT713: 150 mA LDO, 5.0V d) a) b) c) d) Temperature Range: Package: CT713 = 5L SOT-23A, Tape and Reel a) b) c) d) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2003 Microchip Technology Inc. DS21350C-page13 TC1054/TC1055/TC1186 NOTES: DS21350C-page 14 2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2003 Microchip Technology Inc. DS21350C - page 15 M WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Marketing Support Division Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 EUROPE Austria Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 China - Hong Kong SAR Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Phoenix 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338 France Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-82966626 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 Germany Microchip Technology GmbH Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 China - Qingdao Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 Italy Microchip Technology SRL Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 India Microchip Technology Inc. India Liaison Office Marketing Support Division Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/25/03 DS21350C-page 16 2003 Microchip Technology Inc. |
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